Viscoelastic properties of maleated polypropylene (MAPP)-modified wood flour/polypropylene composites (WPC) were investigated by both a compression stress relaxation method and dynamic mechanical analyses (DMA). Three wood to polymer ratios (40:60, 60:40, and 80:20) and five MAPP loading levels (0, 1, 2, 4 and 8%) were used to study their effects on the viscoelastic properties of MAPP-WPC. The results show that: 1) higher wood to polymer ratio corresponds to higher stress relaxation levels for unmodified WPC. The modification with MAPP has an obvious effect on the stress relaxation of MAPP-WPC at higher wood to polymer ratios (60:40 and 80:20), but almost no effect at the 40:60 wood to polymer ratio. The optimal MAPP loading level for the wood to polymer ratio of 60:40 appears at 1%; 2) the storage modulus reaches its maximum at a MAPP loading level of 1% for wood to polymer ratios of 40:60 and 60:40, while for the 80:20 wood to polymer ratio, a higher storage modulus is observed at higher MAPP loading levels, which is quite consistent with the stress relaxation results. The results suggested that a suitable loading level of MAPP has a positive effect on the viscoelastic properties of WPC at higher wood to polymer ratios. Excessive MAPP loading would have resulted in adverse effects.
Interfacial compatibility is a crucial factor to the performance of wood-plastic composites (WPCs). Yet, so far, the cou-pling mechanisms of WPC have not been completely understood. In order to further clarify the interfacial coupling mechanism, the dielectric constant and dielectric loss factor of Simon poplar wood flour/polypropylene composites without additives at different wood contents were measured at oven-dry state, and parameters and thermodynamic quantities of the relaxation process were also analyzed and calculated. Consequently, an obvious relaxation process based on the reorientation of methanol groups in amorphous region of wood cell wall was observed exactly that its dielectric loss factor peak decreased with the decreasing wood content within the measured range of 50%-100%. With the trend of dielectric relaxation strength, the two changing trends both revealed that the existence of polypropylene could hinder reorientation of methanol groups. Following the decreasing wood contents, the effect of the hindrance on the dielectric properties turned obvious gradually. It elucidated that introduction of polypropylene caused the quantities of hydrogen bonds formed between each methanol group and the groups around it change. The same conclusion could be drawn from the analysis of thermodynamic quantities during the dielectric relaxation progress.
In order to improve the dimensional stability of wood-polymer composites, wood flour pre-treated by polyethylene glyco1 (PEG) at two different concentrations and then thermally treated at 140°C, was used as raw material to produce wood flour/polypropylene (PP) composites at a wood content of 40%. The structure of modified wood flour was analyzed with a scanning electron microscope (SEM) and its effect on the physical and mechanical properties of wood flour/PP composites was evaluated. The SEM results indicated the "bulking" effect of PEG on wood flour, which resulted in reduced water uptake. The combination of PEG and heat treatment further improved the moisture resistance of the composites. However, PEG modification had a negative effect on the flexural modulus of rupture (MOR) and the modulus of elasticity (MOE); whereas heat treatment partly compensated for this reduction. For dynamic mechanical properties, PEG treatment decreased the storage modulus (E′). However, the heat treatment resulted in an increase of E′ of the wood flour/PP composites, with the temperature of loss factor peaks shifting to a higher temperature.
