The free shrinkage of ceramic or metal is restricted due to solidification of the solder. Hence the shrinkage stress arises and the jointing strength is reduced during the brazing of high-voltage vacuum interrupters （HVVIs）. The solder bound contour was gained by solved energy bound equation. The finite element model of weld beads was established with Surface Evolver software. Then the stress in two different cooling techniques （ natural cooling and force cooling） was calculated with ANSYS. Comparing the stress, a better cooling technique was selected for HVVIs. Its cooling time is shortened by 3 hours while the jointing stress doesn＇ t increase and the tensile strength of ceramic to metal seal is not decreased. The stress-rupture tests have validated the calculated results. More important, a method is found, by which the brazing technique could be improved in advance instead of blind experiments.
