A wedge shape Si LED is designed and fabricated with 0.35 μm double-grating standard CMOS technology. The device structure is based on the N-well-P+ junction. The P+ has a wedge shape and is surrounded by the N-well. The micrographs of Si LEDs' emitting and layout are captured. The I-V characteristic and spectra of the Si LED are tested. Under room temperature and backward bias, its radiant luminosity is 12 nW at 100 mA, and the wavelength of the emitting peak is located at 764 nm.
A monolithically integrated optical receiver, including the photodetector, has been realized in Chartered 0.35μm EEPROM CMOS technology for 850 nm optical communication. The optical receiver consists of a differential photodetector, a differential transimpedance amplifier, three limiting amplifiers and an output circuit. The experiment results show that the receiver achieves an 875 MHz 3 dB bandwidth, and a data rate of 1.5 Gb/s is achieved at a bit-error-rate of 10-9. The chip dissipates 60 mW under a single 3.3 V supply.
A MOS-NDR（negative differential resistance） transistor which is composed of four n-channel metaloxide -semiconductor field effect transistors（nMOSFETs） is fabricated in standard 0.35μm CMOS technology.This device exhibits NDR similar to conventional NDR devices such as the compound material based RTD（resonant tunneling diode） in current-voltage characteristics.At the same time it can realize a modulation effect by the third terminal. Based on the MOS-NDR transistor,a flexible logic circuit is realized in this work,which can transfer from the NAND gate to the NOR gate by suitably changing the threshold voltage of the MOS-NDR transistor.It turns out that MOS-NDR based circuits have the advantages of improved circuit compaction and reduced process complexity due to using the standard IC design and fabrication procedure.
A zero-pole cancellation transimpedance amplifier（TIA）has been realized in 0.35μm RF CMOS technology for Gigabit Ethernet applications.The TIA exploits a zero-pole cancellation configuration to isolate the input parasitic capacitance including photodiode capacitance from bandwidth deterioration.Simulation results show that the proposed TIA has a bandwidth of 1.9 GHz and a transimpedance gain of 65 dB·Ωfor 1.5 pF photodiode capaci- tance,with a gain-bandwidth product of 3.4 THz·Ω.Even with 2 pF photodiode capacitance,the bandwidth exhibits a decline of only 300 MHz,confirming the mechanism of the zero-pole cancellation configuration.The input resis- tance is 50Ω,and the average input noise current spectral density is 9.7 pA/√ Hz.Testing results shows that the eye diagram at 1 Gb/s is wide open.The chip dissipates 17 mW under a single 3.3 V supply.
This paper presents a realization of a silicon-based standard CMOS,fully differential optoelectronic integrated receiver based on a metal–semiconductor–metal light detector（MSM photodetector）.In the optical receiver, two MSM photodetectors are integrated to convert the incident light signal into a pair of fully differential photogenerated currents.The optoelectronic integrated receiver was designed and implemented in a chartered 0.35μm, 3.3 V standard CMOS process.For 850 nm wavelength,it achieves a 1 GHz 3 dB bandwidth due to the MSM photodetector’s low capacitance and high intrinsic bandwidth.In addition,it has a transimpedance gain of 98.75 dBΩ, and an equivalent input integrated referred noise current of 283 nA from 1 Hz up to–3 dB frequency.
A standard CMOS optical interconnect is proposed, including an octagonal-annular emitter, a field oxide, metal 1-PSG/BPSG-metal 2 dual waveguide, and an ultra high-sensitivity optical receiver integrated with a fingered P＋/N-well/P-sub dual photodiode detector. The optical interconnect is implemented in a Chartered 3.3-V 0.35-μm standard analog CMOS process with two schemes for the research of the substrate noise coupling effect on the optical interconnect performance： with or without a GND-guardring around the emitter. The experiment results show that the optical interconnect can work at 100 kHz, and it is feasible to implement optical interconnects in standard CMOS processes.
