This paper aims at developing a stochastic-elastic model of a soft elastic body adhering on a wavy surface via a patch of molecular bonds.The elastic deformation of the system is modeled by using continuum contact mechanics,while the stochastic behavior of adhesive bonds is modeled by using Bell's type of exponential bond association/dissociation rates.It is found that for sufficiently small adhesion patch size or stress concentration index,the adhesion strength is insensitive to the wavelength but decreases with the amplitude of surface undulation,and that for large adhesion patch size or stress concentration index,there exist optimal values of the surface wavelength and amplitude for maximum adhesion strength.
This study intends to investigate how the elasticity of a bacterial phage can afect the process of DNA packaging and ejection.For this purpose,we propose a unified continuum and statistical mechanics model by taking into account the efects of DNA bending deformation,electrostatic repulsion between DNA–DNA strands and elastic deformation of the phage capsid.Based on such a model,we derive the quantitative relations between packaging force,elasticity of capsid,DNA length remaining in the capsid,osmotic pressure and ejection time.The theoretically predicted results are found to agree very well with in vitro experimental observations in the literature.
This paper presents an analytical solution for the thermoelastic stress in a typical in-plane's thin-film microthermoelectric cooling device under different operating conditions. The distributions of the permissible temperature fields in multilayered thin-films are analytically obtained, and the characteristics, including maximum temperature difference and maximum refrigerating output of the thermoelectric device, are discussed for two operating conditions. Analytical expressions of the thermoelastic stresses in the layered thermoelectric thin-films induced by the temperature difference are formulated based on the theory of multilayer system. The results demonstrate that, the geometric dimension is a significant factor which remarkably affects the thermoelastic stresses. The stress distributions in layers of semiconductor thermoelements, insulating and supporting membrane show distinctly different features. The present work may profitably guide the optimization design of highefficiency micro-thermoelectric cooling devices.
A finite element approach based on the micromechanics was performed to estimate the multi-field properties of electro-magneto-thermoelastic composites. The thermal field and the involved pyroelectric and pyromagnetic effect of the multi-phase composite materials were taken into account in the investigation and implemented in the finite element modeling. The multifields related to the electric field, magnetic field, deformation and temperature field, as well as their coupling effects of the smart composites under periodic boundary conditions were obtained numerically. Especially, by means of the homogenization approximation, the effective thermal expansion coefficients, pyroelectric coefficients, pyromagnetic coefficients and other elastic, electric,and magnetic properties for the piezoelectric material, piezomagnetic material and magnetoelectric material were calculated, respectively. Some results are compared to the theoretical predictions by the well-known Mori-Tanaka method to show good agreements.
