The tunnel field-effect transistor(TFET) is a potential candidate for the post-CMOS era.As one of the most important electrical parameters of a device,double gate TFET(DG-TFET) gate threshold voltage was studied.First,a numerical simulation study of transfer characteristic and gate threshold voltage in DG-TFET was reported.Then,a simple analytical model for DG-TFET gate threshold voltage VTG was built by solving quasi-two-dimensional Poisson equation in Si film.The model as a function of the drain voltage,the Si layer thickness,the gate length and the gate dielectric was discussed.It is shown that the proposed model is consistent with the simulation results.This model should be useful for further investigation of performance of circuits containing TFETs.
基于k·p微扰理论框架,研究建立了单轴张/压应变Si,Si基双轴应变p型金属氧化物半导体(PMOS)反型层空穴量子化有效质量与空穴面内电导率有效质量模型.结果表明:对于单轴应力PMOS,选择单轴压应力可有效增强器件的性能;同等增强PMOS空穴迁移率,需要施加的单轴力强度小于双轴力的强度;在选择双轴应力增强器件性能时,应优先选择应变Si1-x Ge x作为沟道材料.所获得的量化理论结论可为Si基及其他应变器件的物理理解及设计提供重要理论参考.
通过合金化改性技术,Ge可由间接带隙半导体转变为直接带隙半导体.改性后的Ge半导体可同时应用于光子器件和电子器件,极具发展潜力.基于直接带隙Ge1-x Sn x半导体合金8带Kronig-Penny模型,重点研究了其导带有效状态密度、价带有效状态密度及本征载流子浓度,旨在为直接带隙改性Ge半导体物理的理解及相关器件的研究设计提供有价值的参考.研究结果表明:直接带隙Ge1-x Sn x合金导带有效状态密度随着Sn组分x的增加而明显减小,价带有效状态密度几乎不随Sn组分变化.与体Ge半导体相比,直接带隙Ge1-x Sn x合金导带有效状态密度、价带有效状态密度分别低两个和一个数量级;直接带隙Ge1-x Sn x合金本征载流子浓度随着Sn组分的增加而增加,比体Ge半导体高一个数量级以上.
Based on the Fermi's golden rule and the theory of Boltzmann collision term approximation, a physically-based model for hole scattering rate(SR) in strained Si1-x Gex/(100)Si was presented, which takes into account a variety of scattering mechanisms,including ionized impurity, acoustic phonon, non-polar optical phonon and alloy disorder scattering. It is indicated that the SRs of acoustic phonon and non-polar optical phonon decrease under the strain, and the total SR in strained Si1-x Gex/(100)Si also decreases obviously with increasing Ge fraction(x). Moreover, the total SR continues to show a constant tendency when x is less than 0.3. In comparison with bulk Si, the total SR of strained Si1-x Gex/(100) Si decreases by about 58%.
