The preparation process of electrically conductive filler for anisotropic conductive adhesive was performed and discussed.The spherical filler contains tri-layer structures: resin core,Ni-P intermediate coating layer,Au outer coating layer.The 4 μm resin spherical cores were synthesized by monodispersion polymerization method.Then they were contributed to electrical conductivity by electrolessly plating Ni-P layer and gold layer.These particles have good corrosion resistance,high stability,and enough mechanical strength.When mixed with thermosetting epoxy resin to produce anisotropic conductive adhesive(ACA),it can realize a good conductive bonding between bumps on dies and pads on substrates.This environmentally friendly conductive material offers numerous advantages over conventional solder technology and is an ideal substitute for the lead-contained solder in electronics packaging.
Advanced testing methods for the dynamics of mechanical microdevices are necessary to develop reliable, marketable microelectromechanical systems. A system for measuring the nanometer motions of microscopic structures has been demonstrated. Stop-action images of a target have been obtained with computer microvision, microscopic interferometry, and stroboscopic illuminator. It can be developed for measuring the in-plane-rigid-body motions, surface shapes, out-of-plane motions and deformations of microstructures. A new algorithm of sub-pixel step length correlation template matching is proposed to extract the in-plane displacement from vision images. Hariharan five-step phase-shift interferometry algorithm and unwrapping algorithms are adopted to measure the out-of-plane motions. It is demonstrated that the system can measure the motions of solder wetting in surface mount technology(SMT).
