通过实验研究了印刷电路板(print circuit board,PCB)设计对小尺寸薄型封装(thin small outline package,TSOP)焊点可靠性的影响.实验制作了包含引脚焊盘的长度、焊盘的表面处理方式及背靠背的双面贴装偏移量3种设计参数的可靠性测试板,并采用表面贴装工艺(surface mount technology,SMT)将TSOP器件焊接到测试板上;经-40～85℃的高低温循环试验后,收集了TSOP引脚焊点裂纹的生长数据;讨论了焊点失效的机理,相应考虑了2种可靠性判断准则,并对各参数条件下的裂纹数据进行比较.结果表明,长尺寸焊盘、有机保焊膜(organic solderability preservatives,OSP)及不对称的两面布置方式有助于提高TSOP引脚的焊点可靠性.
The Mn-doped Ce02 nanopowders with high catalysis activity were successfully fabricated through a simple hydrolyzed-oxidized approach. Firstly, the alloy Ce37Mnl 8C45 was prepared in vacuum induction melting furnace. Subsequently, Mn-doped CeO2 nanopowders with 142 m2/g of specific surface area were obtained through a simple hydrolyzed-oxidized procedure of the alloy Those nanopowders were heat treated at different temperatures. The obtained materials were characterized by X-ray diffraction （XRD）, transmission electron microscopy （TEM）, high-resolution transmission electron microscopy （HRTEM） and energy dispersive spectroscopy （EDS）. And the catalytic activity on vinyl chloride （VC） emission combustion was investigated. The results showed that those nanopowders after hydrolyzed-oxidized from Ce37Mn18C45 mainly consisted of CeO2 and Mn304. Manganese element increased the thermal stability of CeO2 nanopowders. The Mn-doped CeO2 nanopowders had three morphologies. Small particles were Mn-doped CeO2, square particles were Mn304 and the rods were Mn304 and Mn203. The Mn-doped CeO2 nanopowders had good vinyl chloride （VC） emission catalytic performance.
