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国家重点基础研究发展计划(KM200710005015)

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相关作者:胡宁金冬月沈珮谢红云李佳更多>>
相关机构:北京工业大学更多>>
发文基金:国家自然科学基金国家重点基础研究发展计划更多>>
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改善多指功率SiGe HBTs热稳定性的版图设计(英文)
2009年
提出非均匀指间距结构功率SiGe HBTs的版图设计用以改善热稳定性。模拟和实验结果均表明,与传统的均匀指间距结构相比,非均匀指间距结构HBT的峰值结温和温度分布非均匀性均得到显著改善。上述改善归功于非均匀指间距结构HBT中心指间距的增加,从而有效阻止热流由外侧指流向中心指处。此外,与均匀指间距结构器件相比,其热阻改善13.71%,热退化功率水平提高22.8%。因此,模拟和实验均证明采用非均匀指间距结构HBT的版图设计可有效改善功率HBTs热稳定性。
金冬月张万荣谢红云沈珮胡宁甘军宁李佳
关键词:SIGEHBT热稳定性
Designing power heterojunction bipolar transistors with non-uniform emitter finger lengths to achieve high thermal stability
2011年
With the aid of a thermal-electrical model, a practical method for designing multi-finger power heterojunction bipolar transistors with finger lengths divided in groups is proposed. The method can effectively enhance the thermal stability of the devices without sacrificing the design time. Taking a 40-finger heterojunction bipolar transistor for example, the device with non-uniform emitter finger lengths is optimized and fabricated. Both the theoretical and the experimental results show that, for the optimum device, the peak temperature is lowered by 26.19 K and the maximum temperature difference is reduced by 56.67% when compared with the conventional heterojunction bipolar transistor with uniform emitter finger length. Furthermore, the ability to improve the uniformity of the temperature profile and to expand the thermal stable operation range is strengthened as the power level increases, which is ascribed to the improvement of the thermal resistance in the optimum device. A detailed design procedure is also summarized to provide a general guide for designing power heterojunction bipolar transistors with non-uniform finger lengths.
金冬月张万荣付强陈亮肖盈王任卿赵昕
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