The thermal conduction behavior of the three-dimensional axisymmetric functionally graded circular plate was studied under thermal loads on its top and bottom surfaces.Material properties were taken to be arbitrary distribution functions of the thickness.A temperature function that satisfies thermal boundary conditions at the edges and the variable separation method were used to reduce equation governing the steady state heat conduction to an ordinary differential equation (ODE) in the thickness coordinate which was solved analytically.Next,resulting variable coefficients ODE due to arbitrary distribution of material properties along thickness coordinate was also solved by the Peano-Baker series.Some numerical examples were given to demonstrate the accuracy,efficiency of the present model,and to investigate the influence of different distributions of material properties on the temperature field.The numerical results confirm that the influence of different material distributions,gradient indices and thickness of plate to temperature field in plate can not be ignored.
