A macro-micro dual-drive positioning system showing good potential for high acceleration and high precision positioning required in IC packaging applications is devised in this paper. The dual-drive positioning stage uses a VCM (voice coil motor) driven macro positioning stage and a PZT piezo-electric driven micro positioning stage. The coupling characteristics of the system are analyzed to produce a control structure with a micro positioning stage that can dynamically compensate for the positioning error produced by the macro positioning stage. Models of the two positioning stages are described. The models cover both the mechanism and the actuator. For the macro positioning stage, friction characteristics are taken into account, and a controller with an LQG (linear-quadratic-Gaussian) control algorithm combining a feed-forward compensation algorithm is derived. A PID controller is used to control the micro positioning stage. Detailed designs are derived for the proposed approach, and the performance is validated by simulation.
In the wire bonding process of microelectronic packaging,heat affect zone(HAZ)is an important factor governing the loop profile of bonding.The height of loop is affected by the length of the HAZ.Factors governing the HAZ were studied.To investigate this relationship,experiments were done for various sizes of wire and free air ball(FAB).Electric flame-off(EFO)current, EFO time,EFO gap and recrystallization were also studied.The results show that as the size of FAB becomes larger,the length of HAZ increases.With the increase of EFO current and time,the length of HAZ becomes longer.When FAB forms at the same parameter the length of HAZ becomes shorter with the high temperature of recrystallization.
