Copper pyrophosphate plating is the most important electroplating process which can instead of copper cyanide electroplating, but the biggest shortcoming is poor adhesion. In this paper, the influence of additives on the properties (especially bonding) of copper coating has been studied using electrochemical methods. The results show that the optimal additives of pyrophosphate copper electroplating are C4H4O6KNa(25g/L)+ H2C2O4(25g/L)and C4H4O6KNa(25g/L),respectively.
