In order to study the electrodeposition process of iridium in composite ionic liquid, the effects of N, N-dimethylacetamide（DMAC） on the viscosity, conductivity and electrochemical stability of composite ionic liquid BMIC-BMIBF4, as well as the electrochemical behavior of Ir Cl3 in this system were studied. Iridium（Ir） coatings were deposited at different constant potentials and characterized by SEM and XRD. The results show that the addition of DMAC can evidently decrease the viscosity of the composite system, increase conductivity and improve electrochemical stability of the composite system. Cyclic voltammograms of a Au electrode illustrate that the process controlled by diffusion rate is irreversible with the average charge transfer coefficient of 0.170 and average diffusion coefficient of 1.096×10-6 cm^2/s. In addition, SEM image shows that Ir film deposited at the reduction peak potential is dense and even, while XRD pattern shows that Ir deposit is polycrystalline structure.
The reduction mechanism of Ir in the NaCl-KCl-IrCl3 molten salt was investigated by cyclic voltammetry and chronopotentiometry, and Ir film was deposited effectively on platinum in potentiostatic mode. The morphology and constitution of Ir film were examined by scanning electron microscopy （SEM）, energy dispersive spectroscopy （EDS） and X-ray diffraction （XRD）. It is found that the reduction mechanism of Ir（III） is a three-electron step and electro reaction is a reversible diffusion controlled process; the diffusion coefficients of Ir（III） at 1083, 1113, 1143 and 1183 K are 1.56×10-4, 2.23×10-4, 2.77×10-4 and 4.40×10-4 cm2/s, respectively, while the activation energy of the electrode reaction is 102.95 kJ/mol. The compacted Ir film reveals that the applied potential greatly affects the deposition of Ir, the thickness of Ir film deposited at the potential of reduction peak is the highest, the temperature of the molten salt also exerts an influence on deposition, the film formed at a lower temperature is thinner, but more micropores would occur on film when the temperature went too high.
